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S73WS-P based MCP Products
1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Mobile SDRAM on Shared Bus
S73WS-P based MCP Products Cover Sheet
Data Sheet (Advance Information)
Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each product described herein may be designated as Advance Information, Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S73WS-P_00
Revision A
Amendment 0
Issue Date March 16, 2006
Notice On Data Sheet Designations
Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. The following descriptions of Spansion data sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion LLC is developing one or more specific products, but has not committed any design to production. Information presented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. Spansion LLC therefore places the following conditions upon Advance Information content:
"This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice."
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment to production has taken place. This designation covers several aspects of the product life cycle, including product qualification, initial production, and the subsequent phases in the manufacturing process that occur before full production is achieved. Changes to the technical specifications presented in a Preliminary document should be expected while keeping these aspects of production under consideration. Spansion places the following conditions upon Preliminary content:
"This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qualification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document may be revised by subsequent versions or modifications due to changes in technical specifications."
Combination
Some data sheets contain a combination of products with different designations (Advance Information, Preliminary, or Full Production). This type of document distinguishes these products and their designations wherever necessary, typically on the first page, the ordering information page, and pages with the DC Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include those affecting the number of ordering part numbers available, such as the addition or deletion of a speed option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a description or to correct a typographical error or incorrect specification. Spansion LLC applies the following conditions to documents in this category:
"This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion LLC deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur."
Questions regarding these document designations may be directed to your local AMD or Fujitsu sales office.
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S73WS-P based MCP Products
S73WS-P_00_A0 March 16, 2006
S73WS-P based MCP Products
1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Mobile SDRAM on Shared Bus
Data Sheet (Advance Information)
Features
Power supply voltage of 1.7 to 1.95V Flash access time: 80 ns for NOR Flash Flash burst frequencies: 66 MHz, 80 MHz, 108 MHz Mobile SDRAM burst frequency: 104 MHz (SDR) Package:
- 9.0 x 12.0 mm MCP
Operating Temperature
- -25C to +85C (wireless)
The S73WS series is a product line of stacked packages and consists of:
One NOR flash memory die One Mobile SDRAM die on shared bus
The products covered by this document are listed in the table below.
DRAM Density Device S29WS256P 128Mb S73WS256PD0 (MCP) (SDR)
Note: For a full list of OPNs, please contact the local sales representative or refer to the Ordering Information valid combinations tables.
For detailed specifications, please refer to the individual data sheets.
Document S29WS-P 128 Mb Mobile SDR-DRAM Type 5 Publication Identification Number (PID) S29WS-P_00 SDRAM_08
Publication Number S73WS-P_00
Revision A
Amendment 0
Issue Date March 16, 2006
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
Data
Sheet
(Advance
Information)
1.
Product Selector Guide
Device S73WS512PD0HF64V NOR Flash Density 512 Mb NOR Flash Speed 66 MHz DRAM Density 128 Mb DRAM Speed 104 MHz (SDR) DRAM Supplier Type 5 Package MCP 9 x 12 mm
2. MCP Block Diagram
2.1 NOR Flash + DRAM MCPs
A0-Amax A0-Amax
F-RDY
RDY
DQ15-DQ0
DQ15-DQ0
F-CLK F-AVD# F-CE# F-OE# F-RST# F-ACC F-WP# F-WE#
CLK AVD# CE# OE# RESET# ACC WP# WE#
WS-P NOR Flash Memory
VSS VSSQ
F-VSS F-VSSQ
VCC VCCQ
F-VCC F-VCCQ
D-RAS# D-CAS# D-BA0 D-BA1 D-CKE D-WE# D-CE# D-VCC D-VCC Q
RAS# CAS# BA0 BA1 CKE WE# CE# A0-Amax VCC VCCQ
CLK
D-CLK
SDR DRAM MEMORY
LDQM UDQM DQ15-DQ0 VSS VSSQ
D-DM0 D-DM1
D-VSS D-VSSQ
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S73WS-P based MCP Products
S73WS-P_00_A0 March 16, 2006
Data
Sheet
(Advance
Information)
3. Connection Diagrams
3.1 512 Mb NOR Flash with 128 Mb SDR-DRAM
137-ball Fine-Pitch Ball Grid Array (Top View, Balls Facing Down)
1 A D-CKE B
2
3
4
5
6
7
8
9
10
Legend
D-CLK
RFU
RFU
D-VSS D-VCC
RFU
RFU
D-VSS
D-CE#
Shared
D-RAS# D-WE# C RFU D RFU E D-VCCQ F D-VSSQ G RFU H RFU J RFU K RFU L RFU M RFU N RFU P RFU D-VSS D-BA0 RFU RFU DNU F-CE# A0 A1 A2 A3 F-WP# F-AVD#
RFU
RFU
D-VSSQ D-VCCQ
RFU
RFU
RFU
D-CAS#
Do Not Use
VSS
F-CLK
RFU
F-VCC
RFU
RFU
RFU
RFU NOR Flash Only
A7
D-DM0 F-ACC
WE#
A8
A11
RFU
RFU DRAM Only
A6
D-DM1 F-RST#
DNU
A19
A12
A15
D-VCCQ Reserved for Future Use
A5
A18
F-RDY
A20
A9
A13
A21
D-VSSQ
A4
A17
A23
A10
A14
A22
RFU
VSS
DQ1
DQ6
A24
A16
RFU
OE#
DQ9
DQ3
DQ4
DQ13
DQ15
DNU
RFU
DQ0
DQ10
F-VCC
RFU
DQ12
DQ7
VSS
RFU
DQ8
DQ2
DQ11
RFU
DQ5
DQ14
RFU
RFU
RFU
VSS
F-VCC
RFU
DNU
F-VCCQ
DNU
RFU
RFU
RFU
D-VSSQ D-VCCQ
RFU
RFU
D-BA1
RFU
RFU
RFU
D-VSS D-VCC
RFU
RFU
DNU
RFU
Note: DDR-only signals are RFUs in the case of the SDR DRAM-based solutions.
3.1.0.1
Special Handling Instructions For FBGA Package
Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150xC for prolonged periods of time.
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S73WS-P based MCP Products
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Data
Sheet
(Advance
Information)
3.2
NOR Flash and DRAM Input/Output Descriptions
Amax-A0 DQ15-DQ0 F-CE# F-OE# F-WE# F-VCC F-VCCQ VSS RFU F-RDY F-CLK = = = = = = = = = = = Address inputs, shared between NOR Flash and DRAM Data input/output, shared between NOR Flash and DRAM NOR Flash Chip-enable input. Asynchronous relative to CLK for Burst Mode. NOR Flash Output Enable input. Asynchronous relative to CLK for Burst mode. NOR Flash Write Enable input. NOR Flash device power supply (1.7 V - 1.95V). Input/Output Buffer power supply. Ground Reserved for Future Use Flash ready output. Indicates the status of the Burst read. VOL = data valid. NOR Flash Clock. The first rising edge of CLK in conjunction with AVD# low latches the address input and activates burst mode operation. After the initial word is output, subsequent rising edges of CLK increment the internal address counter. CLK should remain low during asynchronous access. NOR Flash Address Valid input. Indicates to device that the valid address is present on the address inputs. VIL = for asynchronous mode, indicates valid address; for burst mode, causes starting address to be latched on rising edge of CLK. VIH= device ignores address inputs NOR Flash hardware reset input. VIL= device resets and returns to reading array data NOR Flash hardware write protect input. VIL = disables program and erase functions in the four outermost sectors. NOR Flash accelerated input. At VHH, accelerates programming; automatically places device in unlock bypass mode. At VIL, disables all program and erase functions. Should be at VIH for all other conditions. SDRAM Chip Select SDRAM Clock Enable SDRAM Bank Select SDRAM Row Address Strobe SDRAM Column Address Strobe SDRAM Data Input/Output Mask SDRAM Write Enable input SDRAM Ground SDRAM Input/Output Buffer ground SDRAM Input/Output Buffer power supply SDRAM device power supply
F-AVD#
=
F-RST# F-WP# F-ACC D-CE# D-CKE D-BA1-BA0 D-RAS# D-CAS# D-DM1-D-DM0 D-WE# D-VSS D-VSSQ D-VCCQ D-VCC
= = = = = = = = = = = = = =
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S73WS-P based MCP Products
S73WS-P_00_A0 March 16, 2006
Data
Sheet
(Advance
Information)
4.
Ordering Information
The order number is formed by a valid combinations of the following:
S73WS
512
P
D0
HF
6
4
V
0 PACKING TYPE 0 = Tray 2 = 7" Tape and Reel 3 = 13" Tape and Reel MODEL NUMBER 2 V = 66MHz/104MHz Speed MODEL NUMBER 1 4 = SDR DRAM x16, Type 5 PACKAGE DESCRIPTOR Depends on Character 12. For a more detailed description see Table 4.1. PACKAGE TYPE & MATERIAL SET HF = 1.2mm MCP FBGA, Pb-free KF = 1.2mm POP FBGA, Pb-free JF = 1.4mm MCP FBGA, Pb-free DRAM & ORNAND FLASH DENSITY D0 = 128 Mb DRAM, No Data Flash PROCESS TECHNOLOGY P = 90 nm, MirrorBitTM Technology CODE FLASH DENSITY 512 = 512Mb PRODUCT FAMILY S73WS Stacked Products (MCP) 1.8 V NOR Flash and Mobile DRAM
Table 4.1 Character Position Descriptions (Sheet 1 of 2)
Character 14 Description Character 12 Character 13 0 1 2 3 4 H, J, or G 5 6 7 8 9 9x12 mm 9x12 mm 11x13 mm 11x13 mm 11x13 mm 115 137 84 115 137 Package Area 7x9 mm 7x9 mm 8x11.6 mm 8x11.6 mm 9x12 mm Package Ball Count 56 80 64 84 84 0.35 mm Raw Ball Size
S73WS-P_00_A0 March 16, 2006
S73WS-P based MCP Products
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Data
Sheet
(Advance
Information)
Table 4.1 Character Position Descriptions (Sheet 2 of 2)
Character 14 Description Character 12 Character 13 A B D F G K H J K L M 14x14 mm 15x15 mm 15x15 mm 17x17 mm 17x17 mm 152 160 160 192 192 0.50 mm 0.45 mm 0.50 mm 0.45 mm 0.50 mm Package Area 11x11 mm 11x11 mm 12x12 mm 12x12 mm 14x14 mm Package Ball Count 112 112 128 128 152 Raw Ball Size 0.45 mm 0.50 mm 0.45 mm 0.50 mm 0.45 mm
4.1
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm availability of specific valid combinations and to check on newly released combinations.
S72WS-P Valid Combinations
Base Ordering Number S73WS512PD0
Package & Material Set HF
Package Descriptor 6
Model Number 4V
Packing Type 0, 2, 3 (Note 1)
NOR Flash Speed 66 MHz
DRAM Supplier Type 5
DRAM Speed 104 MHz
Package Type 9x12 mm (MCP)
Package Markings (Note 2)
Notes: 1. Packing Type 0 is standard. Specify other options as required. 2. BGA package marking omits leading S and packing type designator from ordering part number.
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S73WS-P based MCP Products
S73WS-P_00_A0 March 16, 2006
Data
Sheet
(Advance
Information)
5. Physical Dimensions
5.1 TLD137--137-ball Fine-Pitch Ball Grid Array (FBGA) 9 x 12.0 mm Package
D
0.15 C (2X)
10 9 8 7 6 5 4
A
D1 eD
SE 7 E1
E eE
3 2 1
INDEX MARK PIN A1 CORNER 10
P NML K J
HG F
EDC
BA
B
7
TOP VIEW
0.15 C (2X)
SD
PIN A1 CORNER
BOTTOM VIEW A A2 A1
6
0.20 C
C
0.08 C
SIDE VIEW b
137X
0.15 M C A B 0.08 M C
NOTES: PACKAGE JEDEC DxE SYMBOL A A1 A2 D E D1 E1 MD ME n b eE eD SD / SE 0.35 TLD 137 N/A 12.00 mm x 9.00 mm PACKAGE MIN --0.17 0.81 NOM ------12.00 BSC. 9.00 BSC. 10.40 BSC. 7.20 BSC. 14 10 137 0.40 0.80 BSC. 0.80 BSC 0.40 BSC. G5,H5,H6 0.45 MAX 1.20 --0.97 PROFILE BALL HEIGHT BODY THICKNESS BODY SIZE BODY SIZE MATRIX FOOTPRINT MATRIX FOOTPRINT MATRIX SIZE D DIRECTION MATRIX SIZE E DIRECTION BALL COUNT BALL DIAMETER BALL PITCH BALL PITCH SOLDER BALL PLACEMENT DEPOPULATED SOLDER BALLS 9. 8. 7 6 NOTE 2. 3. 4. 5. 1. DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994. ALL DIMENSIONS ARE IN MILLIMETERS. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010. e REPRESENTS THE SOLDER BALL GRID PITCH. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION. SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION. n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME. DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE PARALLEL TO DATUM C. SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW SD OR SE = 0.000. WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, SD OR SE = e/2 "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS. N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3393\ 16-038.22a
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S73WS-P based MCP Products
7
Data
Sheet
(Advance
Information)
6.
6.1
Revision History
Revision A (March 16, 2006)
Initial release.
Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products. Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright (c) 2006 Spansion LLC. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, and combinations thereof are trademarks of Spansion LLC. Other names are for informational purposes only and may be trademarks of their respective owners.
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S73WS-P based MCP Products
S73WS-P_00_A0 March 16, 2006

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